Magnum Technologies Pty Ltd.

PCB Fabrication

Magnum enjoys over 15 years of reputation as a PCB supplier of high quality standards and competitive pricing. We are qualified and experienced to use standard FR-4, high Tg, halogen free and high speed/ultra low loss materials. Our clientèle extends to medical, gaming, telecommunication and industrial electronics.

Range of PCBs

Double sided PCBs
Multilayer up to 16 layers
RoHS compliant (Tg>170°C) PCBs
High Density Interconnect PCBs
Flexible
Rigid-flex PCBs

Specialization

Advanced high layer line card
- High performance standard/mid/low loss and Green materials
- Advanced registration system for tight D2M design
Sequential build up
- N+N, N+M+N structure
- Sequential line card technology for high speed application
High layer backplane
- Backplane board size up to 40"x20"
- Provider for Telecom
HDI line card
- Large format System HDI board

Value Added Services through Product Life Cycle

R&D
- Design for manufacturing
- Material selection
- Panelization
- Optimization
New Product Introduction (NPI)
- Prototyping
- Pilot testing
- Technical support on issues emerging from prototyping
Production
- Cost-effective solution
- Reduced lead time
- Price reduction
Maturity
- High volume
- Improve yield and further cost reduction

PCB Product Overview

Material

Type of Lamination	Model	Type of Lamination	Model
Normal Tg	SYL S1141 MICA EG 150T PANASONIC R1755C	High Tg w/ Filler	SYL S1000-2 MICA HR-02 PANASONIC R1755V NELCO N4000-29
Middle Tg	SYL S1141KF SYL S1000 MICA LA-02	Mid/Low Loss	ISOLA FR408, FR408HR NELCO N4000-13, 13SI, 13 EP MITSUBISHI EL-190T HITACHI MCL-HE-679G
Halogen Free	SYL S1155 R-1566W, WN, V NPGN 150, 170	Ultra Low Loss	ROGER 4350/4000 PANASONIC MEGTRON 6
High Tg	SYL S1170 MICA HR-01 PANASONIC R1755V	PTFE	TACONIC RF-35A2

Production Capabilities

Elements	Capability	Elements	Capability
Max. circuitry width	564mm	Base copper weight (Inner layer)	1/3oz – 4oz
Max. circuitry length	1021mm	Base copper weight (Outer layer)	1/4oz – 3oz
Max. layer count	20	Press-fit hole size tolerance	± 0.05mm
Max. board thickness	8mm	Aspect ratio (Line card)	15:1
Max. board thickness tolerance	± 8%	Aspect ratio (Back panel)	16:1
Routing outline tolerance	± 10mm	Type of Finishes
Impedance ≤ 50Ω Impedance ≥ 50Ω	+/- 8% +/- 4Ω	Single Surface Finishes	ENIG (Autotech CNN/ NPR-8) Electrolytic Nickel Gold Plating Immersion Tin (Stanntech) Immersion Silver (Sterling) OSP (Entek Plus HT), HASL
Min. inner trace spacing (Line card) Min. inner trace spacing (Back plane) Min. outer trace spacing (Line card) Min. outer trace spacing (Back plane)	0.075/0.075mm 0.075/0.075mm 0.075/0.090mm 0.100/0.114mm	Dual Surface Finishes	ENIG (Autotech CNN) + OSP Tab gold (G/F) + I-Silver Tab gold (G/F) + HASL Tab gold (G/F) + OSP

Production Lead Time

	Lead Time (Days)
Layer	Standard Protos	Express Protos	Mass Production
2	5	3	10
4	6	3	14-21
6	7	4	18-21
8	8	5	21-24
10	10	6	23-26
12 and above	12	6	From 30